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Finnish company HMD Global has launched a new HMD Fuse smartphone aimed specifically at children. According to the company, it is the world's first smartphone that prevents children from filming, broadcasting or viewing nude and sexually explicit content, even while streaming.
MediaTek Announces Dimensity 9500 and 8500 Chips – More Performance, AI, and Better Battery Life
15. 01. 2026 Thursday / By: Robert Denes / Industrial / Exact time: BST / Print this page
M ediaTek has announced the new Dimensity 9500 and Dimensity 8500 SoCs, with which the company is targeting the flagship and premium smartphone segments even more strongly. According to the manufacturer, both circuits are designed to bring better performance, energy efficiency, AI features, and advanced imaging and connectivity capabilities to the market.
HSINCHU, Taiwan - January 15, 2026MediaTek has announced Dimensity 9500s and Dimensity 8500. As the latest members of the Dimensity family, both products focus on delivering outstanding performance, efficiency, AI, imaging, gaming, and wireless connectivity, driving new momentum into the flagship and premium smartphone segments."JC Hsu, president of MediaTek’s Wireless Communications Business Unit, says the company aims to bring cutting-edge technologies to more users while improving the balance between performance and power consumption."
The Dimensity 9500s is built on a 3-nanometer manufacturing process and uses the so-called All Big Core architecture. The chip has a Cortex-X925 ultracore clocked at up to 3.73 GHz, three Cortex-X4 cores and four Cortex-A720 cores. MediaTek says the solution enables the highest level of performance without excessive power consumption.
"As leaders in smartphone global share, we are committed to increasing our investment in advanced technologies and striving to make bleeding-edge products available to more people,” said JC Hsu, corporate senior vice president at MediaTek and general manager of the Wireless Communications Business Unit. “This mission is evident in this pair of Dimensity chipsets, which are intended to provide more flagship and premium smartphone experiences while upholding our vision in bringing the best possible performance and power efficiency to more people."
Graphics are powered by the Immortalis-G925 chip, which supports advanced features such as ray tracing. The company has also invested in gaming-specific power savings with new MAGT 3.0 and MFRC 3.0 technologies, which are designed to extend the operating time of demanding games.
The Dimensity 9500s’ neural network unit is specifically designed for generative AI models and multimodal inference. This can be seen in live image post-processing, AI-based image editing, and intelligent compression of calls, meetings, and files, among other things.
In terms of imaging, the chip supports 8K Dolby Vision HDR video recording at 30 frames per second, as well as real-time motion tracking focus, which further improves the quality of videos and images.
In terms of connectivity, the Dimensity 9500s supports a 5G Release-17 modem with download speeds of up to seven gigabits, improved power saving with UltraSave 4.0 technology, optimization of weak networks with AI Network Suite 2.0, and extended Wi-Fi range with Xtra Range 3.0. In addition, Bluetooth connectivity between phones can reach a distance of up to five kilometers.
The Dimensity 8500, on the other hand, is more affordable, designed for premium devices, and is manufactured using a 4-nanometer process. It uses eight Cortex-A725 cores, clocked at up to 3.4 GHz, and supports high-speed LPDDR5X memory. MediaTek promises that this combination will provide a smooth everyday user experience and long battery life.
On the graphics side, improvements to the Mali-G720 increase performance by up to a quarter compared to the previous generation, while reducing power consumption by a fifth. This chip also includes ray tracing support, which brings even more lifelike graphics to more mobile games.
The Dimensity 8500 features MediaTek’s eighth-generation NPU, which supports large language models and image generation. Artificial intelligence is also used to improve the quality of telephoto photography and intelligently optimize image content.
The new Dimensity chips are expected to appear in future high-end and premium phones from several manufacturers in 2026.
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